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Holistic tin-plating on the outer conductor is one of the key processes in the manufacture of semi-flexible coaxial cable, which is widely applied to the third generation (3G) mobile communication system. However, in the traditional horizontal tin-plating process, disadvantages such as the pinhole defects and low productivity effect cannot be avoided. In this paper, a vertical tin-plating process was proposed to reduce the pinhole defects and improve the tincoating quality. Compared with the traditional horizontal tin-plating process, the immersion length was reduced from 300-400 mm to 10-100 mm and the tin-plating time was reduced from 7 s to 3 s in the proposed method. The experimental results indicate that immersion length and time are key parameters for the tin-plating quality. With this new tin-plating process, the experimental results show that the pinhole defects can be eliminated effectively by controlling the immersion depth below 100 mm and tin-plating time at 3 s. The thickness of tin-coating increased from not more than 5 μm to 12.3 μm with the proposed vertical tin-plating process. Meanwhile, the thickness of the intermetallic compounds (IMCs) layer between the tin-coating and copper wires was reduced from 3.26 μm to 0.62 μm if the immersion time decreased from 30 s to 1 s. Besides, a self-developed flux, which possesses a boiling point or decomposed temperature of active components over 300℃, exhibits a better efficiency in reducing the pinhole formation. 相似文献
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Evolution of Surface Oxide Film of Typical Aluminum Alloy During Medium-Temperature Brazing Process简 总被引：1，自引：0，他引：1
The evolution of the surface oxide film along the depth direction of typical aluminum alloy under medium-temperature brazing was investigated by means of X-ray photoelectron spectroscopy （XPS）. For the alloy with Mg content below 2.0wt%, whether under cold rolling condition or during medium-temperature brazing process, the en-richment of Mg element on the surface was not detected and the oxide film was pure Al2O3. However, the oxide film grew obviously during medium-temperature brazing process, and the thickness was about 80 nm. For the alloy with Mg content above 2.0wt%, under cold rolling condition, the original surface oxide film was pure Al2O3. However, the Mg element was significantly enriched on the outermost surface during medium-temperature brazing process, and MgO-based oxide film mixed with small amount of MgAl2O4 was formed with a thickness of about 130 nm. The alloy-ing elements of Mn and Si were not enriched on the surface neither under cold rolling condition nor during medium-temperature brazing process for all the selected aluminum alloy, and the surface oxide film was similar to that of pure aluminum, which was almost entire Al2O3. 相似文献
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With the squeeze of electrode tips, the oxide film on aluminum (Al) alloy surface is broken and numbers of micro-gaps are formed randomly. The micro-gaps act as conducting spots at the beginning of welding, so the contact resistance is extremely high and unstable in spot welding of Al alloy. In this paper, a new contact resistance model is adopted to simulate the nugget forming process. This model describes the random distribution characteristic of conducting spots. The simulation results indicate that, within the first 5 ms of welding current (AC, 50 Hz), the temperature distribution at the workpieces interface is seriously irregular. In addition, the nugget does not nucleate from the weld center and grow continuously, however, it nucleates randomly from several points almost instantaneously and then merges into an entity quickly. Experimental results agreed with the numerical simulation. 相似文献
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