| 微型片式元件焊接过程立碑工艺缺陷的机理分析与解决 |
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| 引用本文： | 王文利,肖玲,梁永生.微型片式元件焊接过程立碑工艺缺陷的机理分析与解决[J].深圳信息职业技术学院学报,2007,5(2):32-35. |
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| 作者姓名： | 王文利 肖玲 梁永生 |
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| 作者单位： | 1. 深圳信息职业技术学院信息技术研究所,广东,深圳,518029
2. 中机十院国际工程有限公司,北京,100083 |
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| 摘 要： | 微型片式元件立碑是电子组装过程常见的工艺缺陷,特别随着电子产品的微型化,立碑的问题越来越突出,本文系统介绍了片式元件立碑的机理及主要影响因素,提出了通过设计、工艺、设备的优化来解决立碑缺陷的主要措施。
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| 关 键 词： | 片式元件 立碑 机理 消除 |
| 文章编号： | 1672-6332（2007）02-0032-04 |
| 修稿时间： | 2007-06-20 |
Formation mechanism、troubleshooting of small chip device's tombstoning process defect |
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| WANG Wenli,XIAO Ling,LIANG Yongsheng.Formation mechanism、troubleshooting of small chip device''''s tombstoning process defect[J].Journal of Shenzhen Institute of Information Technology,2007,5(2):32-35. |
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| Authors: | WANG Wenli XIAO Ling LIANG Yongsheng |
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| Institution: | 1. Research of Information Technology, Shenzhen Institute of Information Technology Shenzhen 518029, P.R.China; 2.International Engineering Company Limited, China Machinery TDI Beijing 100083, P.R.China |
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| Abstract: | Tomstoning is a popular soldering process defect for small chip device. Along with electrical products structure is smaller and smaller, the chip devices are widely used and tomstoning is becoming a popular defect Formation mechanism and root causes of tomstoning are introduced in this paper. Then troubleshooting solutions for tomstoning defect are presented with optimum design, process and equipment. |
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| Keywords: | chip device tomstoning mechanism troubleshooting |
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