| 表面安装器件SMD贴装工艺研究 |
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| 引用本文： | 李永清.表面安装器件SMD贴装工艺研究[J].中国科技信息,2011(16):81-81,86. |
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| 作者姓名： | 李永清 |
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| 作者单位： | 铁岭师范高等专科学校理工学院,辽宁,铁岭,112000 |
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| 基金项目： | 辽宁省教育科学“十一五”规划项目(项目号:JG08DB225),课题主持人:李永清 |
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| 摘 要： | 针对目前电子产品元器件贴装工艺高度普及、表面安装器件SMD大量被使用的现状,通过对表面安装器件SMD的介绍,分别研究了SMD分立器件、SMD集成电路以及大规模集成电路的贴装方式,对各种贴装方式加以比较,提出最佳贴装工艺方案。
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| 关 键 词： | 表面安装器件 SMD器件 贴装工艺 |
SMD Surface Mount Device Placement Process |
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| LI Yongqing.SMD Surface Mount Device Placement Process[J].CHINA SCIENCE AND TECHNOLOGY INFORMATION,2011(16):81-81,86. |
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| Authors: | LI Yongqing |
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| Institution: | LI Yongqing Institute of Technology,Tieling Teachers College,Tieling Liaoning,112000,China |
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| Abstract: | For the current electronic component placement process a high degree of popularity,SMD surface mount device is used a lot of the status quo,through the introduction of SMD surface mount devices,discrete devices were investigated SMD,SMD integrated circuits and VLSI placement method,to compare a variety of mounting methods,with the best placement process plan. |
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| Keywords: | Surface Mount Devices SMD devices Placement process |
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