| 立体组装电路模块动态特性的有限元模拟与分析 |
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| 引用本文： | 黄春跃,周德俭,黄红艳.立体组装电路模块动态特性的有限元模拟与分析[J].上海大学学报(英文版),2004,8(Z1). |
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| 作者姓名： | 黄春跃 周德俭 黄红艳 |
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| 摘 要： |
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Simulation and Analysis of Dynamic Characteristics of 3D Assembly Circuit Module with Finite Element Method |
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| Abstract: | Based on the modal analysis theory and by using the dynamics finite element analysis model of a three-dimensional assembly circuit module, dynamic characteristics of circuit module have been studied, including both natural characteristics analysis and dynamic responses analysis. Using a subspace method, modal analysis is first carried out. The first 6 orders of natural frequencies and vibration modes are obtained. Influence of the number of the Z-shaped metal slices on dynamic characteristics of the entire structure is also studied.Harmonic response analysis is then conducted. The steady-state response when the circuit module is subjected to harmonic excitation is determined. A curve of the response values against frequencies is obtained. As a result, the optimal number of Z-shaped metal slices can be determined, and it can be assured that the three-dimensional assembly circuit module has good performance in terms of the dynamic characteristics. |
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| Keywords: | three-dimensional assembly circuit module finite element analysis model modal analysis harmonic response analysis |
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