| 手机外壳注塑成形模拟分析及方案优化 |
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| 引用本文： | 刘明俊,刘白,赵振宇.手机外壳注塑成形模拟分析及方案优化[J].深圳信息职业技术学院学报,2010,8(4):73-78. |
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| 作者姓名： | 刘明俊 刘白 赵振宇 |
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| 作者单位： | 深圳信息职业技术学院信息控制与制造系,广东深圳518029 |
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| 基金项目： | 广东省自然科学基金，深圳市科技计划项目 |
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| 摘 要： | 利用MoldFlow软件对手机外壳的注塑成形过程进行了模拟,分析了充填过程中的冷却时间、翘曲、收缩、塑件壁厚、充填压力、锁模力等参数及质量因素。研究了注塑过程中的不稳定性因素以及产生翘曲、变形的原因等主要问题,结果表明产品变形的主要原因是不均匀收缩。据此对注塑充填方案进行了优化,使得最大射压降低了11.9%,最大锁模力降低了33.9%,总变形量降低了42.7%。
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| 关 键 词： | 注塑模 手机外壳 翘曲 |
Simulation and optimization for molding process of cell phone cover |
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| LIU Mingjun,LIU Bai,ZHAO Zhenyu.Simulation and optimization for molding process of cell phone cover[J].Journal of Shenzhen Institute of Information Technology,2010,8(4):73-78. |
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| Authors: | LIU Mingjun LIU Bai ZHAO Zhenyu |
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| Institution: | (Department of Information Control ＆ Manufacturing,Shenzhen Institute of Information Technology, Shenzhen 518029,P.R.China) |
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| Abstract: | Mold flow software was applied to the analysis of injection molding of the mobile phone cover so as to solve the main problems of warpage and injection unbalance of the product.The cooling duration,warpage,sink mark,wall thickness,filling pressure,clamping force and other parameters were analyzed.According to the results of filling analysis,the filling scheme was improved.For the optimized scheme,the maximum injection pressure decreased by 11.9%,the maximum locking force decreased by 33.9%,and the total deformation by 42.7%. |
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| Keywords: | injection molding mobile phone cover warpage |
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