基于电磁兼容技术的多层PCB布线设计 |
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引用本文: | 李翠花,吴疆.基于电磁兼容技术的多层PCB布线设计[J].合肥联合大学学报,2007,17(3):19-21,55. |
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作者姓名: | 李翠花 吴疆 |
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作者单位: | [1]合肥学院基础教学部,合肥230022 [2]合肥海尔信息产品有限公司开发部,合肥230601 |
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基金项目: | 安徽省教育厅科研基金重点项目(2004kj002zd)资助. |
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摘 要: | 随着现代电子技术的发展以及芯片的高速化和集成化,各种电子设备系统内外的电磁环境更加复杂,因此在印制电路板的电路设计阶段考虑电磁兼容性(EMC)设计是非常重要的.以12层板为例讨论了多层PCB分层方法、布线的规则、地线和电源线布置以及电磁兼容性.
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关 键 词: | 电磁兼容 多层印刷电路板 布线 接地 |
文章编号: | 1673-162X(2007)03-0019-03 |
收稿时间: | 2007-04-17 |
修稿时间: | 2007-05-09 |
Design of Multilayer Printed Circuit Board Based on the Electro-magnetic Compatibility |
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Authors: | LI Cui-hua WU Jiang |
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Abstract: | With development of electronic technique and chip integration, electro-magnetic environment of muhi-eletronic equipment is more and more complicated so as in the design of the Printed Circuit Board. It is very important to take electro-magnetic compatibility into account. This paper discusses the electro-magnetic compatibility of the multilayer Printed Circuit Board, through delimitation and regulation of the singal line, electronic source line and grounding line. |
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Keywords: | electro magnetic compatibility muhilayer printed circuit board design grounding |
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