| 碱性化学镀Ni－Cu－P工艺研究 |
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| 引用本文： | 崔绍波.碱性化学镀Ni－Cu－P工艺研究[J].辽宁科技学院学报,2016,18(3). |
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| 作者姓名： | 崔绍波 |
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| 作者单位： | 辽宁科技学院生物医药与化学工程学院,辽宁本溪,117004 |
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| 基金项目： | 辽宁科技学院大学生创新创业训练计划项目(201511430064) |
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| 摘 要： | 通过正交试验，以硫酸镍和硫酸铜为主盐、次磷酸钠为还原剂研究了铝片表面的化学镀Ni－Cu－P工艺，其最优工艺配方为：硫酸镍25 g／L，硫酸铜2．0 g／L，次亚磷酸钠24 g／L，柠檬酸钠45 g／L，硫脲2．5mg／L，NaF 0．15 g／L，OP－100．8 mg／L，pH值9，温度70℃，施镀时间40min。通过耐硝酸变色试验检测了沉积层的抗蚀性，并讨论了沉积层抗蚀性的影响因素。
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| 关 键 词： | Ni-Cu-P化学镀 碱性 抗蚀性 因素 |
Study on the technology of Alkaline Electroless Plating Ni-Cu-P |
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| Abstract: | Taking nickel sulfat copper sulfat as main salt ,hypophosphite as the reduced agent , and by means of orthogonal experiment , the paper dtudies the technology of electroless plating Ni -Cu-P on the surface of aluminium plate .The optimal process formula is i-dentified as below:NiSO4 · 6H2 O 25g/L, CuSO4 · 5H2 O 2.0g/L,NaH2 PO2 · H2 O 24g/L, sodium citrate 45g/L, CN2 H4 S 2.5mg/L, NaF 0.15g/L, OP-10 0.8mg/L, ph value 9, temperature 70, and plating time 40min.The corrosion resistance pf deposited layer is checked by means of nitric acid resisting , and many effects on the deposits are investigated . |
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| Keywords: | Electroless plating Ni -Cu-P Alkaline Ability of corrosion Resistance Factors |
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