| 基于ANYSYS的电路板组件的跌落仿真 |
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| 引用本文： | 毛兰斌.基于ANYSYS的电路板组件的跌落仿真[J].苏州市职业大学学报,2007,18(3):73-75. |
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| 作者姓名： | 毛兰斌 |
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| 作者单位： | 苏州市职业大学,远程教育学院,江苏,苏州,215004 |
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| 摘 要： | 基于ANSYS/LS-DYNA的结构动力分析模块,对印刷电路板组件进行了跌落仿真分析,模拟了整个跌落撞击过程,分析不同边界条件以及封装件的布置方式对电路板组件动态响应的影响。
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| 关 键 词： | 跌落仿真 有限元分析 动态响应 |
| 文章编号： | 1008-5475（2007）03-0073-03 |
| 修稿时间： | 2007-03-20 |
Drop-impact Simulation of PCB Assembly |
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| MAO Lan-bin.Drop-impact Simulation of PCB Assembly[J].Journal of Suzhou Vocational University,2007,18(3):73-75. |
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| Authors: | MAO Lan-bin |
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| Institution: | Suzhou Vocational University, Suzhou 215104, China |
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| Abstract: | In the paper,a finite element analysis is carried out to simulate the response phenomenon of PCB assembly that falls and collides with a rigid surface by using ANSYS/LS-DYNA.The process of drop-impact is simulated.The paper also deals with the effects of boundary of PCB and mount form of package to the dynamic responses of PCB assembly. |
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| Keywords: | drop simulation finite element analysis dynamic response |
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