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| 电子封装中各向异性导电胶的可靠性 | |
| 引用本文： | 刘建影,路秀真,曹立强.电子封装中各向异性导电胶的可靠性[J].上海大学学报(英文版),2007,11(1):1-1. |
| 作者姓名： | 刘建影 路秀真 曹立强 |
| 作者单位： | Key State Lab of Advanced Displays and System Integration and SMIT Center Shanghai University，Key State Lab of Advanced Displays and System Integration and SMIT Center Shanghai University，SMIT Center Department of Microtechnology and Nanosciences Chalmers University of Technology，SE-412 96 Gteborg，Sweden，Shanghai 200072，P.R.China SMIT Center，Department of Microtechnology and Nanosciences，Chalmers University of Technology，SE-412 96 Gteborg，Sweden，Shanghai 200072，P.R.China |
| 基金项目： | Acknowledgment The authors wish to thank their colleagues： LAI Zong- he, FU Ying, CHEN Liu, CHENG Zhao-nian, M0 Zhi-min and Z0U Gang, who have been engaged in conductive adhesive research at Chalmers and have generated a tremendous research results during last ten years. Also we wish to acknowledge the financial support from the SMIT Center member company： Hitachi Chemicals, Japan. |
| 摘 要： | Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications. |
| 关 键 词： | 电子封装 各向异性 导电胶 可靠性分析 |
| 收稿时间： | 2006-09-25 |
| 修稿时间： | 2006年9月25日 |
Reliability aspects of electronics packaging technology using anisotropic conductive adhesives |
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| LIU Johan,LU Xiu-zhen,CAO Li-qiang.Reliability aspects of electronics packaging technology using anisotropic conductive adhesives[J].Journal of Shanghai University(English Edition),2007,11(1):1-1. | |
| Authors: | LIU Johan LU Xiu-zhen CAO Li-qiang |
| Institution: | 1. Key State Lab of Advanced Displays and System Integration and SMIT Center, Shanghai University,Shanghai 200072, P. R. China;SMIT Center, Department of Microtechnology and Nanosciences, Chalmers University of Technology, SE-412 96 G(o)teborg, Sweden 2. Key State Lab of Advanced Displays and System Integration and SMIT Center, Shanghai University,Shanghai 200072, P. R. China 3. SMIT Center, Department of Microtechnology and Nanosciences, Chalmers University of Technology, SE-412 96 G(o)teborg, Sweden |
| Abstract: | Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years.It is time to make a summary of what has been done in this field.The present paper reviews the technology development,especially from the reliability point of view.It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications. |
| Keywords: | electronics packaging anisotropic conductive adhesives reliability |
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