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| 铜基电子封装材料研究进展 | |
| 引用本文： | 王常春,朱世忠,孟令江.铜基电子封装材料研究进展[J].临沂师范学院学报,2008,30(6):43-47. |
| 作者姓名： | 王常春 朱世忠 孟令江 |
| 作者单位： | 1. 临沂师范学院物理系,山东临沂,276005 2. 山东医学高等专科学校,山东临沂,276002 3. 临沂市高新技术开发区罗西街道办事处,山东临沂,276014 |
| 摘 要： | 介绍了国内外铜基电子封装材料的研究现状及最新发展动态，指出了目前我国新型铜基电子封装材料研究中所存在的问题及进一步完善的措施，预测了电子封装用铜基复合材料的发展趋势和应用前景．未来的铜基电子封装材料将朝着高性能、低成本、轻量化和集成化的方向发展． |
| 关 键 词： | 电子封装 铜基复合材料 热导率 热膨胀系数 |
Progress of Research on Cu-based Electronic Packaging Materials |
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| WANG Chang-chun,ZHU Shi-zhong,MENG Ling-jiang.Progress of Research on Cu-based Electronic Packaging Materials[J].Journal of Linyi Teachers' College,2008,30(6):43-47. | |
| Authors: | WANG Chang-chun ZHU Shi-zhong MENG Ling-jiang |
| Institution: | WANG Chang-chun, ZHU Shi-zhong, MENG Ling-jiang(1. Department of Physics, Linyi Normal University, Linyi Shandong 276005, China; 2. Shandong Medical College, Linyi Shandong 276002, China; 3. Linyi High-tech Development Zone, Linyi Shandong 276014, China) |
| Abstract: | The characteristics,present status,application prospect and existing problems of copper-matrix composites for electronic packaging are described.The problems and their improving methods of new electronic packaging materials used in our country are discussed.And the developing tendency of copper matrix electronic packaging materials is forecasted.It is believed that high performance,low cost,light weight and integration will be the future characteristics of copper matrix electronic packaging materials. |
| Keywords: | electronic packaging copper matrix composites thermal conductivity coefficient of thermal expansion |
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