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Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications. 相似文献
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Micro-pin-fin cooler mounted on the power chip enables the heat removal to meet modern microsystem requirement. Carbon nanotubes
(CNTs) have been proven as a potential material for micro-coolers due to the superior thermal conductivity, good mechanical
property and so forth, and there appear various applications of CNTs in the micro-cooler technology. In the present paper,
an analysis of the thermal and hydraulic characteristics of the micro-pin-fin heat sink was conducted, where air was used
as the cooling medium and an impinging jet was introduced to enhance the heat transfer. Three-dimension computational fluid
dynamics (CFD) simulations were carried out for micro-pin-fin coolers with various parameters, including the pin-fin size
and pattern as well as the jet velocity and nozzle diameter. The flow field and thermal properties of the micro-pin-fin heat
sink were obtained, and the heat removal efficiency was evaluated. 相似文献
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